(Sep 26th) Heterogeneous Integration: From materials and devices to systems toward AIoT applications

  • Subject
    Heterogeneous Integration: From materials and devices to systems toward AIoT applications
  • Date
    2019.09.26 (Thu) 16:00
  • Speaker
    Kyusang Lee / Electrical and Computer Engineering Department/ University of Virginia(Assistant Professor)
  • Place
    Wooribyul Seminar Room(E3-2, #2201)
Overview: 

Heterostructures composed of dissimilar materials have generated great interest because of the unique functionalities that cannot be offered by homogeneous structures owing to their unique properties. Interfacing mixed-dimensional materials, with band alignment strongly influenced by the unique nature of each material system, enables drastic changes in the electrical, magnetic, optical, and thermal properties beyond its individual counterpart. Thus, appropriate selection of dissimilar materials can allow significant modification of their physical structures resulting in intriguing properties and unprecedented device architectures. Here, I will introduce unique techniques to produce single crystalline thin-film semiconductors via epitaxy and exfoliation from graphene-coated crystalline substrates, termed remote epitaxy and 2-dimensional layer based transfer process. This technology enables heterogeneous integration of various materials on a single platform. Furthermore, I will present promising applications of hetero-integration for light detection and ranging by integrating GaN-based HEMT and GaAs VCSEL. Furthermore, integration of sensors with AI hardware platform for edge computing applications will be discussed.

Profile: 

Kyusang Lee is currently an Assistant Professor of Electrical and Computer Engineering and Materials Science and Engineering departments at University of Virginia. He received his B.S. degree from Korea University in 2005, M.S. degree from Johns Hopkins University in 2009, and Ph.D. degree from University of Michigan in 2014, all in Electrical Engineering. He was a postdoctoral fellow in the Department of Electrical Engineering and Computer Science at the University of Michigan, and a postdoctoral associate in the Department of Mechanical Engineering at Massachusetts Institute of Technology (MIT). His research interests highlight the use of thin-film compound semiconductors in optoelectronic devices, with a particular emphasis on applications for imaging and artificial intelligence. He is the recipient of the best student presentation award at the IEEE 38th Photovoltaic Specialist Conference and the UMEI postdoctoral fellowship.

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