The forth industrial revolution will be the “revolution of manufacturing technology” that approaches the extreme by establishing a mutual communication system between production equipment and products through the Internet of things and optimizing the entire production process. It is expected to be embodied in a system that integrates space. Candidate technologies that will make key contributions include artificial intelligence, robots, internet, and cognitive technologies, as well as display, sensor and semiconductor device technologies. Future display technologies will require vigor, bi-directional, flexible, high-definition, new materials, and three-dimensional technologies. Biometric information recognition, ultra-wearable, . Next-generation semiconductor technology will require ultra-high-density, ultra-low-power logic devices and memory technology to implement a CPU that corresponds to human brain size and computational power.
This seminar will cover the topics and contents related to the next generation device technologies that have been preliminarily researched and developed. In the display field, technologies such as bi-directional display and transparent optical sensor that can communicate with users and devices are presented. In the field of sensors, they will be covered in electronic skin consisting of sensor networks that perform low power or self-power functions. In the next-generation semiconductor field, we will refer to the possibility of new memory as a 2-3 terminal device technology using a hafnia ferroelectric. This new memory device technology is ultimately applicable to non-volatile logic-in-memory and multi-logic logic as well as to novel logic logic. It is also applicable to storage class memories with recent technological needs, We judge by technology. Thank you for your interest.