Professor Sang-Hyeon Kim’s paper on the multi-color photodetector which can be used as a compact photonic sensor for AI chip was presented in VLSI symposia 2019*.
*VLSI symposia is the one of flagship conference in VLSI society.
Title: Monolithic integration of GaAs//InGaAs photodetectors for multicolor detection
Multicolor photodetectors (PDs) by using bulk p-i-n based visible GaAs and near-infrared (IR) InGaAs PD was successfully fabricated via monolithic integration by wafer bonding and epitaxial lift-off. It showed high-performance individual operation comparable to that of bulk PDs with tight vertical alignment on a single substrate for future high-resolution multicolor PDs. At the same time, it covered a broad wavelength range from visible to IR.
Figure 1. Multi-Color Photodetector
