삼성전자DS사업총괄사업분야및관련기술안내
Memory Business▶Business Field: DRAM (DDR, RDD, XDR, GDDR, UtRAM, OneDRAM), Flash Memory (NOR, NAND),Flash Solution (OneNAND, SSD, Card), MCP SRAM (Low Power SRAM, High Speed SRAM), NewMemory▶Major Technology-Hardware Design ·DRAM(DDR / Mobile / Graphic), Flash memory(Nor / Nand), PRAM, Analog &Digital Circuit·Memory Card Controller : RTL Coding, Synthesis, Static Timing Analysis,AMBA-based bus protocol & ARM-based SOC chip design, DFT Implementation, SATA, SAS, PCIe, USB2.0 / 3.0, SD / MMC interface, ARM-based embedded SW development &HW validation, System VerilogVerification, FPGA Implementation & Verification,Signal Processing Algorithm Development for Memory & Storage System, Channel Codes(Error Detection / Correction Codes) Design &HW / FW IP Design-Software Design· System SW, Computer Architecture, Memory &Storage Algorithm Design,FTL, Flash Memory File System, Journaling File System Design,Virtual Memory Management, Cache Algorithm, Dynamic Memory Management,Application Processor, Multimedia Processor, Memory Card Controller F / W,Inter-Processor Communication Algorithm Design,Parallel Processing Algorithm for SMP / AMP multi-Processor,HW &SW Performance Trade-off, SW Engineering, Embedded System Test, Test Case Design, Dependability,Fault Tolerant System Test, Embedded System Development Process, Performance Analysis, OS, I / O System, Storage System,Infra(Clear Case, Clear Quest, Test Automation Tool)-Device Process·Oxidation, Photo Resist, Photolithography, Etch, Diffusion, Cleaning, Thin Film, Ion Implantation, CVD, Metallization, Device Isolation, Transistor, Capacitor,Dielectric, SiO2 / SiONGate Dielectrics,High-K / Metal Gate, Device Analysis-Manufacturing Technology· Yield Enhancement,Metrology(Pattern Process Inspection, Critical Dimension Measurement)-Quality & Reliability Technology-Engineering Statistics, Reliability Engineering(Component & System),Data Mining & Operations ResearchTest & Package Center▶Business Field: Device Packaging,Module,Testing(MCP, Flip chip, TSV, WFP, WLP, SSDetc.)▶Major Technology-Back-End Process: Back-grinding, Die attach, Interconnection, Encapsulation, Chip stack,Module-Test : Test program development,Application circuit design / analysis, Test board design / analyze / evaluation, Device fault analysis, Test system operation-Facility: Automation, System engineering, Robotics, Vibration engineering, Machine vision system-Etc: Distributionsimulation, Quality engineering(analysis)
System LSI Business▶Business Field:-SOC Solution (Mobile CPU, Multimedia SOC,Power management IC, Wireless connectivity, etc), -LSI Solution (Display Driver IC, CMOS Image Sensor, Smart Card, MCU) -ASIC / Foundry▶Major Technology-Design: Digital design, Analog circuit design, Chip Implementation, RF, Imagepixel design, Multimedia IP design (Graphics, Audio, Video), Design verification, High speed I / F, Wireless connectivity, Memory controller, Chip evaluation, Back-end design (Layout),Algorithm (Security, Image processing, Storage) etc.-Software : Embedded S / W(OS, Middle ware, Application), Firmware solution, S / W Engineering,SQA,S / W Infra, Security, Solution Development-Device / Process : Technology Development (28nm, 32nm, 45nm), Unit Process (Lithography, Etch,Diffusion, Thin Film, CMP, Cleaning,IonImplantation, Metal), Process Architecture, Device / ProcessIntegration, Optic, Optoelectronics, Transistor, Capacitor, Dielectric-CAE : Device Modeling, Process Modeling, CAD, TCAD, Design for Manufacturing-PE / Test : Pattern Inspection, Image Processing-Yield Enhancement : Defect Reduction, Contamination Evaluation , Particle Detection, Chemical Analysis-Manufacturing : Simulation, APC, MSPC / FDC, Logistics / Scheduling, MIS, SCM -Strategic Marketing : Market Research/Analysis, Biz Development, Market Strategy, Product(line) MKT, Overseas Sales, Product Planning, Foundry MKT (Tech. MKT), Customer Engineering (Tier 1 Customer) -Planning : Biz Strategy / Research, Contract/Law Case, M&A / Venture InvestmentSemiconductor R&D Center▶Business Field: Semiconductor Advanced Process and Device Technology▶Major Technology-Advanced Process Development· Photolithography (including EUV, e-beam, OPC / RET) Photo Resist, Oxidation, Cleaning &CMP, Diffusion, Thin Film, CVD, Ion Implantation, Metallization, Metrology &Inspection, etc.※ OPC : Optical Proximity Correction (Comput. Litho)-Module Development· Device Isolation, Transistor, Capacitor, Dielectric· High-K / Metal Gate, SiO2 / SiONGate Dielectric / Low-K, Interconnect, etc. -FEOL / BEOL Process Integration (DRAM / Flash / Logic, etc.)-New Memory : PRAM, STT-MRAM, ReRAM, etc.-TCAD / ECAD· Process &Device Modeling, Material Modeling· Circuit Compact / Reliability Modeling, Circuit Simulator Development · System-level Modeling / Simulation, Virtual platform, HW / SW Co-design· Simics, CoWare, SOC Designer user· Memory Controller,Memory Architecture,SSDresearch experience-Advanced CMOS Image Sensor(CIS) Development· Pixel Design, Image Signal Processing, Mixed IC Design, Analog/Digital Design, CIS Process Develop-Logic Design Infra Development. Process design kit development, Design rule generation, Test pattern generation,Layout assembling,Logic digital design, analogy design, circuit simulation. -Package Development. Flip Chip/Wafer level PKG, Thiningand PKG/Chip Warpagecontrol, Vibration and Noise control . Polymer properties & failure Analysis and Development, Thermal and electrical engineering
LCD Business
▶Business Field
-LCD Displays : TV,Monitor, Note PC, Tablet, DID(Digital Information Display),etc.
-New Displays : Electro Wetting Display, MEMS Display,3D Display without Glasses, Interactive Display,
Green Display,Transparent Display, FlexibleDisplay,etc.
▶Major Technology
-Device Technology Development
· Product Technology : Note PC, Monitor, LCD-TV LCD Panel, Transmission Type / Reflective Type LCD
Panel, High-transparent Organization, Light Recycling Organization, System Integration Technology,
Device Test, Process Architecture, Transparent LCD Panel,MEMS DisplayElectro Wetting Display
· Design Technology(Color, Driver Circuit, LightSource, CAE) : TFT / CF Circuit, Backlight Design,
Mechanism Design, Module Design, Color Processing, Image Processing, SMPS Power LCD Driving
Circuit, Low-consumption Low-electric Power Driving Circuit Design, Timing Controller,
Interface Circuit, Backlight, CCFL, Fluorescent Lamp, LED, Inverter, Optical Film, Device Simulation,
Optical Simulation, Process Simulation, Device / Element Analysis, CAD S / W
-Process Development
· TFT / CF Process, LTPS Process, LC Mode / Process, Module Process, Material Development :
Photo Lithography, CVD, Sputter, Wet / Clean, Dry Etching, Photo Resist, Organic Insulator, Stripper,
Etchant, Electronics Material, Low Temperature Poly Silicon Crystallization, ELA(ExcimerLaserAnneal),
SLS(sequential lateral solidification), MILC(metal induced lateral crystallization) Liquid Crystal,
Low Tension / High Speed Liquid Crystal Material, Liquid Crystal Mode, Alignment Layer, Rubbing, LC
Alignment Adhesives, Anisotropic Conductive Film, OLB, SMT, Printed Circuit, Chip On Glass, Pbfree
-Display Development / Optics
· Flexible Display, Geometric Optics, Surge Optics, Thin Film : New Display Mode, Evaporation,
Ink Jet Printing, Roll-to-Roll Process, Low Temperature High Tension Process Technology
-Machine Design
· Mechanism Design : Three Dimension CAD Utilization Technology,
Molding Technology (Injection Molding Analysis), Thermal Analysis, Impulse Analysis Reliability Test
-Material Element
· Analysis : Three Dimension CAD Utilization Technology, Molding Technology (Injection Molding Analysis),
Thermal Analysis, Impulse Analysis Reliability Test Surface Analysis, Credibility Analysis,
Biography Element, Chemistry Analysis
-Production Technology
· Production Technology : Device Analysis, Device Test FAB, Process Architecture LCD Liquid Crystal,
LCD Panel, Installation Estimation
· Mass Production Technology :Lithography, Wet Clean, CMP RTP, Diffusion, Oxidation CVD,
Metalization, Ion Implation, Dry Etch Facility, Material, Instrumentation Technology, Pollution Analysis
-Software
· System S / W, application S / W
InfraTechnology Center▶Business Field: Manufacturing System, Facility Planning / Operating (Electric Power, Water, Gas, Chemical, Green Technology, Clean Room), system Technology(SCM, PLM, EES, MOS, YMS, MIS, MSS, MES, APC), etc(Hygiene, Environment, Security)▶Major Technology-Materials: FabMaterial Development Technology(Material Design / Quality / Analysis and Optimization Technology / Optimization of Fabrication Process Application Material)-Control of Environmental Contamination : (Clean Room Pollution Control), Control of Contaminated Headwater originated from Fabrication Process(Productivity Enhancement of Mass Production Facility / Improvement of Fault, FOUM / EREM Pollution Control)-Analysis : Fault Analysis Solution and Contamination Evaluation of New Materials-Facility Technology : Utility System Design, Electrical System Design, Electrical System Design, C / R Design, Gas / Chemical, Atmosphere / Energy Technology, Water Treatment Control-S / W : SE, SQA, Firmware-Etc : Hygienic / Environmental Engineering, Production Scheduling
