Tzong-Lin Wu (S’93–M’98–SM’04–F’13) received the B.S.E.E. and Ph.D. degrees from National Taiwan University (NTU), Taipei, Taiwan, in 1991 and 1995, respectively.
From 1995to 1996, he was a Senior Engineer with the Microelectronics Technology Inc., Hsinchu, Taiwan. From 1996 to 1998, he was with the Central Research Institute, Tatung Company, Taipei, Taiwan, where he was involved with the analysis and measurement of electromagnetic compatibility (EMC)/electromagnetic interference (EMI) problems of high-speed digital systems. From 1998 to 2005, he was with the Electrical Engineering Department, National Sun Yat-Sen University. He is currently a Distinguished Professor with the Department of Electrical Engineering of NTU, and serves as a Director in Graduate Institute of Communication Engineering of NTU since 2012. In summer 2008, he was a Visiting Professor with the Electrical Engineering Department, University of California at Los Angeles (UCLA). His research interests include EMC/EMI, signal/power integrity design for high-speed digital/optical systems, and microwave circuits.
Dr. Wu is the Chair of the Taipei Section, IEICE (2007–2011), the Treasurer of the IEEE Taipei Section (2007–2008), and a Member of the Directors of the IEEE Taipei Section (2009–2010 and 2013–2016). He was a Distinguished Lecturer of the IEEE Electromagnetic Compatibility (EMC) Society (2008–2009). He was the Co-chair of the 2007 IEEE EDAPS Workshop, TPC Chair of IEEE EDAPS Symposium in 2010 and 2012, and General Chair of 2015 Asia Pacific EMC Symposium (APEMC). He received the Excellent Research Award and Excellent Advisor Award of NSYSU (2000 and 2003), the Wu Ta-You Memorial Award of the National Science Council (NSC) in 2005, the Technical Achievement Award of IEEE EMC Society in 2009, the 2010 Best Paper Award of IEEE Transactions on Advanced Packaging, and the Outstanding Research Award from NSC both in 2010 and 2013, 2015 IEEE EMC Society Motohisa Kanda Award for a IEEE T-EMC paper with highest citation for those published papers in past 5 years. He is currently serving as an Associate Editor for the IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY and the IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY.