O Bio : 

Jiseon Paek received the B.S., M.S., and Ph.D. degrees in electrical engineering from the Korea Advanced Institute of Science and Technology (KAIST), Korea, in 2004, 2006, and 2011, respectively. Since 2011, he has been with Samsung Electronics, where he leads various projects developing envelope tracking (ET) ICs, fully integrated power ICs, and CMOS RF transceivers for mobile handset applications. Due to his excellent contributions in the area of envelope tracking, he serves in Technical Program Committee (TPC) of IEEE International Solid State Circuit Conference (ISSCC), foremost global forum for presentation of advances in solid-states circuits and system-on-a-chip.