Master’s candidate Taesoo Kim from Professor Jeongho Kim’s lab achieved remarkable success by winning the Best Paper Award at the ‘IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2024‘, held on December 17-19 at the Taj Yeshwantpur, in Bangalore, India.
The ‘IEEE EDAPS’ is the largest and most influential conference on semiconductor packaging technology in the Asia-Pacific region. Since 2002, it has been annually organized and hosted by the IEEE Electronic Packaging Society.
The award-winning paper, titled “Design and Analysis of Twin Tower High Bandwidth Memory (HBM) Architecture for Large Memory Capacity and High Bandwidth System,” was authored by mater’s student Taesoo Kim as the first author.
This paper received high acclaim for its creativity, completeness and future scalability. In particular, the innovative concept of implementing the “Twin Tower” structure to effectively address the limitations of traditional memory designs, and the ability to present a new direction in memory architecture for supporting ultra-large AI models, were recognized and led to the prestigious Best Paper Award.
