(August 3) Integrated Circuits and Microsystems for Emerging Biomedical Applications

Minkyu Je received the MS. and Ph.D. degrees, both in Electrical Engineering and Computer Science, from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Korea, in 1998 and 2003, respectively. In 2003, he joined Samsung Electronics, Giheung, Korea, as a Senior Engineer and worked on multi—mode multi-band RF transceiver SoCs for GSM/GPRS/EDGE/WCDMA standards. From 2006 to 2013, he was with Institute of Microelectronics (IME), Agency for Science, Technology and Research (A*STAR), Singapore. He worked as a Senior Research Engineer from 2006 to 2007, a Member of Technical Staff from 2008 to 2011, a Senior Scientist in 2012, and a Deputy Director in 2013. From 2011 to 2013, he led the Integrated Circuits and Systems Laboratory at IME as a Department Head. In IME, he led various projects developing low-power 3D accelerometer ASICs for high-end medical motion sensing applications, readout ASICs for nanowire biosensor arrays detecting DNA/RNA and protein biomarkers for point-of-care diagnostics, ultra-low-power sensor node SoCs for continuous real-time wireless health monitoring, and wireless implantable sensor ASICs for medical devices, as well as low-power radio SoCs and MEMS interface/control SoCs for consumer electronics and industrial applications. He was also a Program Director of NeuroDevices Program under A*STAR Science and Engineering Research Council (SERC) from 2011 to 2013, and an Adjunct Assistant Professor in the Department of Electrical and Computer Engineering at National University of Singapore (NUS) from 2010 to 2013. Since 2014, he has been an Associate Professor in the Department of Information and Communication Engineering at Daegu Gyeongbuk Institute of Science & Technology (DGIST), Daegu, Korea. His main research areas are advanced IC platform development including smart sensor interface ICs and ultra-low-power wireless communication ICs, as well as microsystem integration leveraging the advanced IC platform for emerging applications such as intelligent miniature biomedical devices, ubiquitous wireless sensor nodes, and future mobile devices. He has more than 220 peer-reviewed international conference and journal publications in the areas of sensor interface IC, wireless IC, biomedical microsystem, 3D IC, device modeling and nanoelectronics. He also has more than 30 patents issued or filed. He has served on the Technical Program Committee and Organizing Committee for various international conferences, symposiums and workshops including IEEE International Solid-State Circuits Conference (ISSCC) and IEEE Asian Solid-State Circuits Conference (A-SSCC).