This course will cover advanced device physics of MOSFETs and their ultimate scaling. Recent trends such as a new device structure and a new material will be introduced, and various types of memory devices as an example of detailed applications are also covered. Through a depth of study in quantum effects, reliability issues, and modeling, this course can provide core knowledge of next device technologies and a chance to explore new applications. (Prerequisite: EE362, EE561)
The course will cover basic physics and applications of various solid-state materials such as metals, semiconductors, dielectrics, thermoelectric materials, and magnetic materials. Also are included the various physics of nanostructures such as quantum well, quantum wire, quantum dots.
This module covers essential process steps in CMOS IC fabrication, focusing on front-end process technology including gate module, shallow junction module, thin film deposition, interconnection, and patterning technology. The students also develop understanding of physical background of each unit process as well as integration issues in modern CMOS devices. Recent developments in front-end processing are also covered.
(Prerequisite: EE211, EE362)