Core Areas
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Circuit division
In 2018, more than 1.5 billion US dollars have been invested in AI Circuits from silicon valley. Big companies (Apple, Google, Samsung, Amazon, etc) are pouring even more money to develop Circuits for AI. Why? Because circuit is the biggest bottleneck in AI. The progress in AI cannot continue without the advancement of circuits that form the core foundation of neural networks and machine learning. Circuit is and will continue to be the hottest area in AI for the upcoming future.
 Website | http://nais.kaist.ac.kr |
| Principal Investigator | Bae, Hyeonmin |
| Location | National Nano Fab Center (E19) |
| Research Area | Mixed mode IC design, High speed broadband communications |
| Website | http://ccs.kaist.ac.kr/ |
| Principal Investigator | Cho, Seonghwan |
| Location | National Nano Fab Center (E19) |
| Research Area | Analog & Mixed signal integrated circuit design for communication, bio-application, and emerging technologies |
| Website | http://impact.kaist.ac.kr |
| Principal Investigator | Je, Minkyu |
| Location | School of Electrical Engineering (E3-2) |
| Research Area | 센서 인터페이스 집적 회로, 무선 통신 집적 회로, 마이크로 시스템 융합 (의료기기, 사물인터넷, 웨어러블 응용) |
| Website | http://seed.kaist.ac.kr |
| Principal Investigator | Jung, Wanyeong |
| Location | School of Electrical Engineering (E3-2) |
| Research Area | Ultra low-power analog/digital circuits and IoT systems |
| Website | https://www.icdesignlab.net/ |
| Principal Investigator | Kim, Hyun Sik |
| Location | School of Electrical Engineering (E3-2) |
| Research Area | Analog Integrated Circuit Design, Display Electronics, Power Conversion & Management IC, Readout IC |
| Website |
https://castlab.kaist.ac.kr |
| Principal Investigator |
Kim, Joo-Young |
| Location |
School of Electrical Engineering (E3-2) |
| Research Area |
VLSI Design, Computer Architecture, FPGA, Hardware/Software Co-Design |
| Website |
http://mvlsi.kaist.ac.kr |
| Principal Investigator |
Kim, Lee-Sup |
| Location |
School of Electrical Engineering (E3-2) |
|
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Multimedia VLSI Design, Low Power High Speed Circuit Design |
| Website |
https://sites.google.com/view/kwongroup |
| Principal Investigator |
Kwon, Kyeongha |
| Location |
School of Electrical Engineering (E3-2) |
| Research Area |
Mixed-signal IC design for high-speed communication and biomedical applications |
| Website |
http://ics.kaist.ac.kr |
| Principal Investigator |
Park, In-Cheol |
| Location |
National Nano Fab Center (E19) |
| Research Area |
Digital Circuit Design, Digital VLSI Design and CAD |
| Website |
https://msicl.kaist.ac.kr/ |
| Principal Investigator |
Ryu, Seung-Tak |
| Location |
School of Electrical Engineering (E3-2) |
| Research Area |
Analog/Mixed-mode Integrated Circuit Design |
| Website |
http://dtlab.kaist.ac.kr/ |
| Principal Investigator |
Shin, Youngsoo |
| Location |
School of Electrical Engineering (E3-2), 6206 |
| Research Area |
Design Technology for VLSI and PIM, Computational Lithography
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| Website | http://ssl.kaist.ac.kr |
| Principal Investigator | Yoo, Hoi-Jun |
| Location | School of Electrical Engineering (E3-2) |
| Research Area | System On Chip design, Healthcare system, Network On Chip with Humanistic processing |
| Website |
http://www.shinhyunlab.kaist.ac.kr/ |
| Principal Investigator |
Choi, Shinhyun |
| Location |
School of Electrical Engineering (E3-2) |
| Research Area |
Neuromorphic Computing device and integrated system |
| Website |
http://www.ndsl.kaist.edu |
| Principal Investigator |
Jung, Myoungsoo |
| Location |
Kim Beang-Ho KIM Sam-Youl ITC B/D (N1) |
| Research Area |
SSD Storage, Non-Volatile Memory, Computer Architecture, File and Operating Systems |
| Website |
https://sites.google.com/view/kaist-via |
| Principal Investigator |
Rhu, Minsoo |
| Location |
Kim Beang-Ho KIM Sam-Youl ITC B/D (N1) |
| Research Area |
VIA (Vertically Integrated Computer Architecture) Research Group |
| Website |
http://rfss.kaist.ac.kr |
| Principal Investigator |
Yu, Jong-Won |
| Location |
School of Electrical Engineering (E3-2) |
| Research Area |
RF Microelectronics, RF and Microwave System Integration |
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